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Bosch gears 200mm fab for automotive ICs

Posted: 16 Feb 2010 ?? ?Print Version ?Bookmark and Share

Keywords:automotive? wafer fab? MEMS?

Robert Bosch GmbH currently is adding the finishing touches to its 200mm wafer fab in near-by Reutlingen.

The fab will start production ramp-up in early Marchwith a delay of about nine months against earlier plans. Also the capacity target apparently has been reduced.

At a conference of automotive electronics experts in Munich, Bosch manager Rainer Kallenbach said the company will start production in the first days of March.

While Kallenbach, a member of the board of Bosch's automotive electronics business unit, said that this is not a formal announcement he provided some details on capacity and technologies used in the fab.

According to Kallenbach, the fab will have a capacity of up to 800 waferstarts per day. In earlier announcements, the company specified the capacity to 1000 waferstarts per day.

The fab will manufacture ASICs, ASSPs, analog ICs, power devices and MEMS for Bosch's captive demand in the first place. It will run BCD4, 4s, 6, 6s and advanced CMOS as well as MEMS processes with feature sizes down to 180?m.

Associated to the production line is also a new test center. The production site will create some 800 jobs. However, the company said earlier that it plans to close an older facility as soon as the new fab is productive.

- Christoph Hammerschmidt
EE Times Europe

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