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RF/Microwave??

Dual-band power amp integrates directional couplers

Posted: 17 Feb 2010 ?? ?Print Version ?Bookmark and Share

Keywords:power amplifier? CDMA? directional coupler?

AWC6323 CDMA PA

From Anadigics Inc. comes the AWC6323 dual-band CDMA power amplifier (PA) for handsets and data cards. For the first time, high-performance directional couplers have been integrated into a dual-band CDMA PA in the 3mm x 5mm x 1mm footprint. The product also offers the low quiescent current, which helps extend the battery life. The innovations built into the AWC6323 enable the latest generation handsets to provide an improved consumer experience.

The AWC6323 is the flagship PA in Anadigics' portfolio of High-Efficiency-at-Low-Power (HELP) family of CDMA PAs. The device is now ramping into volume production and complete evaluation kits are available upon request.

"The AWC6323 has received tremendous response from our customers. Customers are particularly enthusiastic about the high levels of integration in a very small package. The innovations inherent to the AWC6323 help simplify design, reduce component count and save on board space. These attributes directly address the needs of today's advanced handsets and data cards," said Prasanth Perugupalli, director of the wireless RF product line at Anadigics. "Anadigics is also offering extensive support for our customers through a front-end reference design kit, utilizing the most commonly used filters and prescribed matching networks to aid in the phone board design and reduce time-to-market."

The AWC6323 offers three mode states to achieve high power added efficiencies at several power levels during the phone operation. It also helps reduce the idle current of the PA 3.5mA for a CDMA power amplifier. This directly helps in increasing the talk time performance of the handset without the need for a DC/DC converter.

The PA features a common output port for the directional couplers built inside the package. These couplers offer 20dB directivity and 22dB coupling factor. This feature helps eliminate the surface mount couplers placed on the phone board.

In addition, the device also meets the stringent linearity requirements of CDMA EV-DO Revisions A and B modulations, to offer very high data rates for smart phones and data cards. The AWC6323 is manufactured on advanced indium gallium phosphide BiFET MMIC technology, offering the highest levels of reliability, temperature stability and ruggedness.

The product also features internal voltage regulation, common Vmode control line, simplified Vcc bus PCB routing, reduced external component count; low-profile surface mount package (1mm) and RoHS compliance (260C).





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