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Camera bridge ICs enable high-speed interface to mobiles

Posted: 25 Feb 2010 ?? ?Print Version ?Bookmark and Share

Keywords:bridge chip? mobile handset? interface? processor?

Toshiba America Electronic Components Inc. (TAEC) is offering three new bridge chips for use in mobile phonesa Mobile Industry Processor Interface (MIPI) camera serial interface (CSI) to a Mobile Display Digital Interface (MDDI) chip (part number TC358740XBG) and two MDDI-MIPI display serial interface (DSI) chips (part numbers TC358760XBG and TC358761XBG).

The products provide high-speed serial interfaces between a mobile phone's baseband or application processor and the phone's display or integrated camera and are a requirement for high-resolution displays and cameras used in smart phones, mobile Internet devices, netbooks, smartbooks and other high-performance mobile devices. They are the latest additions to Toshiba's Mobile Product Initiative product portfolio designed to help customers implement more advanced technologies in their mobile phone designs.

"Smart phones and other mobile devices have become increasingly feature rich, supporting functions like high-definition video, 3D graphics, high-resolution still image and video capture and even video conferencing," said Deepak Prakash, director, digital multimedia business development, ASSP business unit at TAEC. "With their support of high-speed MIPI and MDDI interfaces, our new bridge chips will allow customers to design mobile devices that can easily handle high-bandwidth communication between the phone's display, camera and baseband or application processor, giving consumers an uncompromised video experience."

The TC358740XBG camera bridge chip provides connectivity for MIPI cameras to baseband or application processors using an MDDI interface. The bridge chip supports MDDI 1.2 Type 2 on the Host side. The device offers support for up to two cameras, with the primary camera using a MIPI link and the secondary camera using a MIPI link or parallel port. The bridge enables high-speed serial interfaces on both the Host via MDDI and camera side via MIPI CSI-2 allowing support for up to 12Mpixel primary camera and up to 2Mpixel secondary camera in one handset. It is compatible with systems using baseband processors with an MDDI interface.

The Toshiba TC358760XBG and TC358761XBG display bridges are optimized for mobile handsets using an MDDI high-speed serial digital packet host interface and provide connectivity of MIPI display panels to baseband or application processors using an MDDI interface. They are based on the MDDI 1.2 Type 1 and MIPI DSI 1.01 interfaces, but are backward compatible with MDDI 1.1. They support direct refresh through the MDDI link. In addition, the TC358761XBG offers support for legacy parallel interfaces such as a MIPI DPI and an MIPI DBI on the host side or the panel side, allowing re-use or extended use of existing design and components. These devices are compatible with systems using baseband processors with an MDDI interface.

Engineering samples of the TC358761XBG display bridge chip and the TC358740XBG camera bridge chip are available now. Engineering samples of the TC358760XBG display bridge will be available April, 2010. Mass production for TC358740XBG is scheduled to begin Q3 10. Mass production for TC358760XBG and TC358761XBG is scheduled to begin Q4 10. All above mentioned parts will be priced at $1.50 per unit in 10,000 unit quantities.





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