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Power management IC packs Class G codec

Posted: 24 Mar 2010 ?? ?Print Version ?Bookmark and Share

Keywords:power management IC? Class G codec? DC/DC converter?

Dialog Semiconductor plc has is rolling out the DA9057system-level power management IC that includes a Class G codec. The device has five on-board DC/DC converters to support 24bit stereo audio headphone playback on a 5-mW power budget.

The DA9057 combines a power sequencer with a programmable filter/mixer engine to support ARM-based multimedia processors. It integrates a dual-input switching USB power manager/Li-ion battery charger plus five programmable DC/DC converters. This architecture increases the current available to a system, enables instant-on operation and allows handsets to run cooler with less time spent charging, Dialog claimed.

The chip has a programming GUI to enable OEMs to alter the system's power sequencing requirements, even when additional functionality is added late in the design cycle. The integrated Class G headphone driver is up to 70 percent more efficient than a standard Class AB amplifier.

A standalone filterless Class D speaker driver has also been introduced. The DA7201 is a 3W mono audio power amplifier capable of driving 4? speaker loads. The component is typically twice as efficient and has a smaller footprint than its Class AB equivalent.

Designed to connect to the DA9057's differential line outputs, its 1.5mm? footprint allows placement close to the speaker, delivering a peak efficiency greater than 90 percent, and reduces heat build-up in portable applications with embedded mono or stereo speakers. Both the DA9057 and DA7201 allow direct battery connection.

Other functions integrated on DA9057 include a programmable LED backlight driver, backup coin-cell charger, touch-screen interface, voice-band codec, automatic level control, general purpose filter engine and five-band equalizer.

Engineering samples of the DA9057 are available now in a 7mm x 7mm BGA 169-pin package. Engineering samples of the DA7201 will be available from April in a wafer level CSP 9 package. Volume production delivery for both devices will begin in Q4 10.

- Peter Clarke
EE Times

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