Ultracompact MOSFETs tailored for portable apps

Fairchild Semiconductor is rolling out a portfolio of high-performance MicroFET MOSFETs packaged in an ultracompact and thin footprint (1.6mm x 1.6mm x 0.55mm) suitable for portable applications.

The new portfolio contains a number of commonly used topology choices, including, single p-channel and Schottky diode combo, single n-channel and Schottky diode combo, dual p-channel, dual n-channel, complementary pair, single n-channel and single p-channel.

These MicroFET MOSFETs are designed with Fairchild's advanced-performance PowerTrench MOSFET process technology. This process technology yields exceptionally low values for R_DS(ON), total gate charge (Q_G) and Miller Charge (Q_GD)—enhancements that result in superior conduction and switching performance and excellent thermal efficiencies. Their advanced MicroFET packaging delivers excellent power dissipation and conduction loss characteristics compared to conventional MOSFET packaging.