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IGBT modules deliver high power density in compact form

Posted: 20 May 2010 ?? ?Print Version ?Bookmark and Share

Keywords:IGBT module? power density? heat sink?

PrimePACK IGBT module

Infineon Technologies AG is rolling out IGBT modules designed for highest power density and reliability: a PrimePACK module with 1400A in 1700V in a PrimePACK 3 packaging, and the new flagship of the EconoDUAL family, the EconoDUAL 3 with 600A in 1200V.

The new PrimePACK 3 module with the designation FF1400R17IP4 with 1400A in 1700V significantly widens the power range of the PrimePACK family. Target applications are renewable energies, traction applications, CAV (construction, commercial and agriculture vehicles) and powerful industrial drives. The new IGBT module addresses the rapidly growing requirements in the market for higher power within the same compact dimensions, paired with highest reliability. The dimensions of the PrimePACK 3 are 89mm x 250mm. The new PrimePACK 3 modulelike the entire family of productshas an intelligent, optimized chip layout and module design. This innovative packaging concept results in an improved distribution and dissipation of heat, reduced thermal transfer resistance between base plate and heat sink, and minimal internal leakage inductance.

The new EconoDUAL 3 module with the designation FF600R12ME4 is at present the most powerful product in the popular EconoDUAL family, offering 600A in 1200V. Typical applications are frequency converters in automation drive systems, central inverters in photovoltaic systems, and diesel generator drives in vehicles (CAV). The optimized module design with regard to interconnection technology and thermal resistance, results in high current utilization and thus high efficiency. With the EconoDUAL 3 FF600R12ME4, the user can increase the power range by up to 30 percent, while the package dimensions remain the same. In addition to the familiar soldered version of the control contacts, the highly reliable PressFIT contact technology has been introduced in the EconoDUAL 3 family.

"Introducing the two new modules in the proven PrimePACK and EconoDual families, Infineon once again underlines its technological leadership in offering IGBT modules with highest power density for energy-efficient, compact designs," says Martin Hierholzer, VP and general manager industrial power at Infineon.

Samples of the IGBT module FF1400R17IP4 of the PrimePACK 3 family will be available in Q3 10, while start of volume production is planned for Q4 10. Samples of the EconoDUAL 3 module FF600R12ME4 are also available, with series production planned for September.

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