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SEMI sees 80% growth in SE Asia IC equipment market

Posted: 24 May 2010 ?? ?Print Version ?Bookmark and Share

Keywords:IC equipment market? Southeast Asia market? semiconductor?

Semiconductor Equipment and Materials International (SEMI) indicated at the SEMICON Singapore 2010 that Singapore is sharing in the strong recovery in global semiconductor sales and the equipment market in this region is expected to grow 80 percent in 2010.

"Southeast Asia leads the world in test, assembly and packaging for the global semiconductor industry," said Terry Tsao, president of SEMI Southeast Asia. "Because of its focus on this area of the technology, SEMICON Singapore 2010 is uniquely positioned to bring companies from throughout the region together to discuss leading technologies and opportunities."

"The Singapore market is growing", said Dan Tracy, senior director, industry research and statistics, SEMI. "Key investments being made in Singapore include the IM Flash fab, which will begin equipping this year, and growth at GlobaFoundries (formerly Chartered Semiconductor), TECH Semiconductor, and UMC, who continue to invest in technology and capacity. SEMI expects Singapore total fab capacity to increase 6.8 percent in 2010, with 300 mm capacity growing at 17 percent."

The SEMI Market Briefing also addressed topics including "Driving the Growth of Singapore's Semiconductor Industry into the Future," by Fong Pin Fen, head of electronics, Singapore Economic Development Board; "Semiconductor Growth and Fundamental Trends," by Kevin Meehan, partner, Bain & Company SE Asia Inc.; "The Outlook for Semiconductor Market," by Philip Koh, research VP, Gartner Advisory Singapore Pte Ltd; and "Semiconductor Equipment and Materials Outlook," by SEMI's Tracy.

Of special interest is the focus on 3D interconnects. Charles Vath, VP, process and package development, ASM Pacific Technology Ltd, and a SEMICON Singapore Session Chair, said, "3D will require a different approach to design at both the chip and packaging levels. 3D packaging brings with it a whole new spectrum of processes, materials, equipment, and the related process, quality and reliability issues."

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