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Survey finds more in favor of193nm, EUV litho

Posted: 02 Jun 2010 ?? ?Print Version ?Bookmark and Share

Keywords:lithography? extreme ultraviolet? EUV? 193nmmmersion?

A survey of more than 130 attendees at the Sematech Litho Forum found few surprises, reflecting the general trend in continuing lithography's current course as the best way to manufacture next-generation chips.

Executives and technology leaders made their plans and preferences known on lithographic approaches.

As at previous such forums, 193nm immersion double patterning continues to be the suitable lithographic technology for volume manufacturing in 2012. Extreme ultraviolet (EUV) would be capable of being placed into manufacturing in 2014, with extendibility into manufacturing in 2016.

The top challenges to manufacturing next-generation devices using immersion double-patterning were said to be cost of ownership, overlay capability, and extendibility to the next-generation device.

As for EUV technology challenges, mask defects, source power, exposure tool throughput, and cost of ownership were rated at the top of the list.

Finally, 193nm and EUV were chosen as the technologies that would be considered for manufacturing at the 32nm node or beyond.

"The fundamental enabler of the industry is improving the cost per function," said Dan Armbrust, president and CEO of Sematech. "For the industry to evolve, business models need to take into account collaborations to control costs and extend current technologies while building the infrastructure for future solutions."

Keynote speaker Gary Patton, VP, Semiconductor Research & Development Center at IBM, focused on the need for industry collaboration and innovation to continue the semiconductor technology roadmap forward and pointed to Sematech's collaboration on EUV infrastructure as a good example of the type of collaborative innovation to make EUV happen.

"This year, more than any other, the EUV community must work collaboratively to address capital cost challenges to set global industry direction, accelerate technology solutions in infrastructure, and bring innovative products to market," said John Warlaumont, VP of advanced technologies for Sematech.

Investing in research
Guest speaker Congressman Paul D. Tonko (NY-Albany) urged the semiconductor executives and technologists companies "must do basic research that will translate into jobs. Only by investing in research today will we ensure the U.S. prosperity."

He said that the course for this must start in community colleges, such as the one in his district, the Hudson Valley Community College. "This is a good example to prepare the work force in hi-tech. Degrees from community colleges will have higher demand for the hi-tech work force than four-year colleges", said Tonko.

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