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IPAD 500?m Flip Chip: package description and recommendations for use

Posted: 04 Jun 2010 ?? ?Print Version ?Bookmark and Share

Keywords:Flip Chips? package description? IPAD flip chip?

This application note provides package and usage recommendation information for 500?m pitch Flip Chips. The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce the dimension of their products, STMicroelectronics has developed packages with reduced size, thickness and weight in the form of the Flip Chip.

The electrical performance of such components in Flip Chips is improved thanks to shorter connections than the ones in standard plastic packages (such as TSSOP, SSOP or BGA).

View the PDF document for more information.

Click here to view related datasheets.





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