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ST, Tsinghua University expand R&D partnership

Posted: 23 Jun 2010 ?? ?Print Version ?Bookmark and Share

Keywords:design tool? ST Tsinghua University R&D? digital multimedia? IC design?

STMicroelectronics and Tsinghua University, Shenzhen Graduate School, have entered a long-term strategic research partnership agreement. This is the second phase of a collaboration that began in 2002 with the setup of a joint ASIC (Application Specific Integrated Circuit) research center.

ST will provide the university with digital multimedia and advanced analog chips, expert support and advanced design tools, and jointly cooperate on applications engineering projects assigned by ST. Under the terms of the strategic partnership, ST will also donate RMB 1 million ($146,550) to the Graduate School each year for five years, with an overall assessment of research efforts conducted each year.

The Graduate School and the Electronic Engineering department of Tsinghua University will staff the long-term partnership with talent, including graduates and technical staff that have important know-how for the market in China, such as local standards and technical specifications in various application fields.

"This partnership provides a great opportunity for Tsinghua University to develop IP blocks and ICs that meet market demand, raising our design and innovation skills to a new level," said Prof. Kang Feiyu, Vice-president of Tsinghua University Graduate School, Shenzhen, "Leveraging our expertise, talents and management to extend the cooperation between us, the partnership is intended for applications that will be commercialized within five years, which is ideal for Chinese designers to sharpen their skills very quickly."

"ST has had a strong technical presence in China for many years. This presence has included manufacturing, IC design and applications teams. The collaboration with Tsinghua will enhance ST's capabilities to tailor our IC solutions to the local market needs," said Francois Guibert, executive VP and president, Greater China and South Asia region, ST. "This partnership with Tsinghua University will contribute to maintaining and further strengthening our relationship with industry leaders in the most dynamic and fastest growing market in the world."

The collaboration with Tsinghua is part of an R&D network established by ST with many world leading universities, research institutes, customers and suppliers in Europe, Asia and America. It aims to bring a dramatic increase in the availability of advanced IP blocks and chips designed in China.

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