Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

TI turns to pillar flip-chip for 45-/40nm node

Posted: 09 Jul 2010 ?? ?Print Version ?Bookmark and Share

Keywords:flip-chip packaging? applications processor? wirebonding technology? 45nm node?

Texas Instruments Inc. announced it will no longer use traditional wirebonding techniques for devices at the 45-/40nm node and below, as the workhorse chip-packaging technology is fast running out of gas for leading-edge designs.

TI will continue to use wirebonding for devices above 45-/40nm. But for those nodes and below, TI is embracing an emerging technology called fine-pitch copper pillar flip-chip packages. The company is jointly working with IC-packaging specialist Amkor Technology Inc. as part of a long-term collaboration in the arena.

To move down the process path, the industry mainly talks about chip scaling and integration. "As an industry, we've over-integrated," said Tom Thorpe, VP and manager of external development and manufacturing at TI.

To enable next-generation designs, chip-packaging is now playing a more critical role in the IC flow, Thorpe said. Technologies like fine-pitch copper pillar flip-chip packages will enable a new class of application processors, DSPs and power management devices, he added.

In fact, for some time, TI has quietly been shipping chips based on pillar flip-chip. "The OMAP device is a standalone applications processor and does not include a baseband, and TI only began shipping an OMAP product based on copper pillar flip-chip earlier this year," according to a TI spokeswoman.

For decades, though, IC makers like TI have used cost-effective and workhorse wirebonders for use in packaging. Chipmakers will continue to use wirebonders for the foreseeable future, but these systems are hitting the wall at the leading-edge, possibly at the 45nm node.

One of the ongoing problems is that wirebonding tends to stress and damage the low-k dielectric interconnects in leading-edge IC designs. There are also performance issues with packages using wirebonders.

As a result, TI and other chipmakers are looking at alternative packaging techniques. In fact, it has been widely known for about two years that TI is moving away from wirebonders for leading-edge designs only, he said. "At 45nm, we won't use anymore wirebonders," he said. TI will continue to use wirebonders for parts at above 45nm, it was noted.

1???2?Next Page?Last Page

Article Comments - TI turns to pillar flip-chip for 45-...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top