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Soldering recommendations for the ceramic vertical mount package

Posted: 15 Jul 2010 ?? ?Print Version ?Bookmark and Share

Keywords:soldering recommendations? vertical mount package? ceramic package?

Soldering electronic components provides not only electrical connections to those components but also a mechanical connection between the component and the PCB or other substrate. In fact, solder often provides the only mechanical connection holding the component in place.

Mechanical sensors, such as MEMS gyroscopes, are especially sensitive to the mechanical reliability of soldering, as compared with solid state devices. Gyroscopes and other MEMS sensors must be soldered with even more attention paid to their mechanical stability because any movement caused by mechanical instability will be translated to an undesired output signal.

This application note describes soldering recommendations for the ceramic vertical mount package (CVMP). The CVMP can be mounted either vertically or lying flat.

View the PDF document for more information.

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