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Applied boosts high-volume TSV manufacturing

Posted: 15 Jul 2010 ?? ?Print Version ?Bookmark and Share

Keywords:through-silicon-vias? 3D TSV? manufacturing?

Aiming to advance through-silicon via (TSV) technology for high-volume manufacturing, Applied has developed the Applied Producer Avila system.

TSV structures connect multiple layers of stacked ICs and are considered a critical technology for future mobile devices. They promise higher performance, more functional, smaller form factor packages that consume less power. With the Applied Producer Avila system, Applied Materials becomes the first equipment supplier to offer comprehensive TSV solutions for speeding the development and time to market of 3D-ICs.

According to market researchers, leading chipmakers are making strategic investments in 3D-TSVs, with more than 15 300mm pilot lines in operation or under development. Applied's wafer-level equipment market opportunity for advanced packaging, including TSV fabrication, is forecast to be nearly $500 million this year.

"3D chip stacking with TSV interconnects provides the industry with a compelling solution to chip scaling, but successful implementation of TSVs requires an unprecedented level of cooperation within the supply chain," said Bart Swinnen, director of interconnect and packaging at IMEC. "Applied is a major contributor in our 3D TSV program where we are developing cost-effective technology solutions that will give an extra dimension to scaling."

In fabricating 3D chip structures is the capability to deposit insulating silicon oxide and nitride films at temperatures less than 200C is very important. The TSVs in these structures are created on exceptionally thin wafers during the final stages of the manufacturing process, where higher temperatures can damage the adhesive used to bond the wafer to its temporary carrier. The Avila system provides customers with ultra-uniform, low-temperature PECVD3 films at up to three times the wafer throughput of competing technologies, enabling up to a 30 percent lower cost-of-ownership. A customer has already qualified the Avila system for pilot production of stacked memory devices.

"Our holistic approach allows us to offer customers a complete toolset for all TSV manufacturing flows encompassing etch, CVD, PVD4, ECD5, wafer cleaning and CMP6," said Randhir Thakur, executive VP and general manager of Applied's silicon systems group. "With our unique ability to validate complete process flows at the Maydan Technology Center, Applied can accelerate learning for customers and consortium members, assuring a smooth transition from R&D to volume production."

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