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DSP, EVM suit intensive processing applications

Posted: 15 Jul 2010 ?? ?Print Version ?Bookmark and Share

Keywords:DSP? processor? EVM? development platform?

TMS320C6457 DSP

Texas Instruments Inc. introduces a new development platform and a new speed grade option for the TMS320C6457 DSP.

The simplified development platform, coupled with the TMS320C6457 850MHz device, can speed development efforts particularly in the defense, networking, test, imaging and industrial markets. It also offers design flexibility and upgrade ability to existing TMS320C6457 processors, at highly competitive price points.

The TMDSEVM6457L Evaluation Module (EVM) includes robust connectivity options such as a breakout card, allowing customers to individually connect certain peripherals to configure the EVM for their needs. It comes bundled with software including TI's Code Composer Studio (CCS v4.2) development environment, and other production and demonstration software components. By delivering these tools and development hardware for high performance DSPs, TI is facilitating access to these devices to a wider range of developers in both existing and emerging applications.

"By offering high value, optimized development solutions at various levels of performance, we are addressing a wider range of developers' requirements, providing them with tools not previously accessible due to cost and performance constraints," said Sandeep Kumar, marketing manager of TI's growth markets and medical business. "TI is listening to and addressing customer needs and developing flexible platforms with a variety of cost and feature options to ease their design processes."

The C6457 is based on TI's TMS320C64x+ DSP core, the 850MHz to 1.2GHz C6457 delivers 6,800 (16bit) MMACs to 9,600 MMACs of peak performance and a cycle for cycle performance improvement of up to 30 percent compared to previous DSP generation. It offers performance improvements enabled by 2MB of on-chip L2 memory (up to 1MB cacheable), faster 32bit DDR2 EMIF (667MHz) and memory, cache and bus architecture enhancements. This gives customers improved cache and memory performance in their designs as well as increased capacity for storing additional data or application features.

The chip comes with high-speed interconnect available with Serial RapidIO and GbE MAC SERDES interfaces for efficient inter-processor communications. It has on-chip acceleration for wireless applications with two Turbo-Decoder Coprocessors (TCP2) and one Viterbi Coprocessor (VCP2). This offloads the compute intensive Forward Error Correction (FEC) functionality from the DSP core, freeing the DSP for other processing functions and tasks, thus lowering total system cost. It is backwards code compatible with other high performance devices in the C62x and C64x DSP family, enabling legacy code reuse for a significantly shorter development cycle and increased design flexibility.

All TMS320C6457 versions and development toolkits are available for ordering. The new 850MHz speed grade is priced at $67 for 1,000-unit volume while the new TMDSEVM6457L EVM is $399. TI also provides a pin compatible upgrade path to affordably priced 1GHz and 1.2GHz versions of this device.





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