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TSMC breaks ground for new Taiwan plant

Posted: 21 Jul 2010 ?? ?Print Version ?Bookmark and Share

Keywords:TSMC? manufacturing? facility?

Taiwan Semiconductor Manufacturing Co. announced it will invest more than $9.4 billion in a new plant in Taichung, Taiwan. The world's largest contract chipmaker said it will create 8,000 jobs at the facility over the next few years.

Morris Chang, chairman and CEO, TSMC, made the announcement on July 16, 2010, at the groundbreaking ceremony for the new semiconductor facility, Fab 15, in Taichung's Central Taiwan Science Park. Fab 15 will be TSMC's third GigafabTM, or fab with capacity of more than 100,000 300mm wafers per month, and will also be TSMC's second GigafabTM equipped for 28nm technology. TSMC is scheduled to begin equipment move-in for the Phase 1 facility in June 2011, with volume production of 40nm and 28nm technology products for customers in the first quarter of 2012.

Fab 15 will be TSMC's next "green fab" following Fab 12 and Fab 14, incorporating green concepts in energy conservation and pollution control in its design, including a process water conservation rate of 85 percent, reclamation of rainwater, recirculation and reuse of general exhaust heat, and development of solar power generation and LED lighting applications. The new facility has a total site area of 18.4ha and will have a building area of 430,000sqm and clean room area of 104,000sqm.





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