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Uprating semiconductors for high-temperature applications

Posted: 02 Aug 2010 ?? ?Print Version ?Bookmark and Share

Keywords:uprating semiconductors? high temperature applications? temperature uprating?

Uprating is used to evaluate a part's ability to function and perform when it is used outside of the manufacturer's specified temperature range. For example, the maximum junction temperature of Micron's DDR SDRAM is 95C. Before including a DDR SDRAM in an application operating above that temperature, a customer would use the process of uprating to determine the related risks. Uprating is possible because semiconductor manufacturers' design significant margin into their products to increase device yield and reliability.

This technical note describes the issues associated with temperature uprating and the risks involved in using components outside the manufacturers' environmental specifications. Through its COTS program, the U.S. Department of Defense has been uprating for a number of years. There are three major concerns with this practice:

1. Device functionality and performanceincluding AC and DC timings, refresh and speed of the part;
2. Device reliability or the reliability of the thin-film MOS device;
3. Package reliability, including concerns with wire bonds and solder joints.

This note focuses specifically on temperature uprating and the significant failure mechanisms associated with operating semiconductors outside their specified temperature ranges. The failure mechanisms apply to all MOS and bipolar semiconductor products, whether manufactured by Micron or any other semiconductor company.

View the PDF document for more information.

Click here to view related datasheets.





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