Solder paste is halogen-free, Pb-free

Indium Corp. introduced the Indium8.9HF-1 solder paste, highlighting the product's halogen-free, Pb-free formulation.

The Indium8.9HF-1 is a no-clean solder paste showing remarkable probe-testability and stencil print transfer efficiency, available for a broad range of processes. It is also designed to be extremely thermally stable while maintain a soft, pliable residue after reflow.

Other key features of the solder paste include: high oxidation barrier, eliminating grapes and head-in-pillow defects; excellent print transfer efficiency on 0.4mm pitch CSPs; halogen-free, as per EN14582 test method; low voiding (less than 5 percent) over many different profiles when soldering BGAs with via-in-pad technology; robust processing window, potentially minimizing defects while accommodating various board sizes and throughput requirements and; compatibility with Sn/Pb alloys.