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Manufacturing/Packaging??

Richard Clemmer talks about NXP's IPO

Posted: 11 Aug 2010 ?? ?Print Version ?Bookmark and Share

Keywords:IPO? fab? stock market? Nasdaq?

EE Times: It's a tough time to do an IPO. Was it the conclusion of the board of directors that you had to do this now?

Clemmer: We are still in the redesign process. We still have about $250 million to $300 million in savings to be implemented. So, we would like our new shareholders to be able to take advantage of the additional cost savings so that they get the benefits of the improved value and the significant growth in design wins that we have, which would yield us improved revenue growth.

EE Times: You joined NXP to see the company through some of its difficulties. Is your job done and are you going to be leaving soon following the IPO?

Clemmer: I am completely committed to ensure we drive success in high-performance, mixed signal ICs. At least for the foreseeable future I will continue in the current role.

EE Times: What's next operationally for NXP?

Clemmer: We've been very successful in the last several quarters with significant design wins at new customers. The real key for us is being able to ramp that efficiently. Just to give a few examples. We will start shipping this quarter our first product for CFL lighting IC-based drivers that would give CFL lighting the capability to do dimmer solutions that they haven't had in the past. Our design wins in high-performance RF have increased 300 percent in the last couple of years and we've increased market share for our microcontroller business two and a half times. The biggest challenge that we have in the near time is making sure that we have sufficient capacity to support our customers.

EE Times: Are you saying manufacturing capacity is currently constrained?

Clemmer: Very much so. We are adding capacity. In the first half of 2010, we spent about $100 million on capital expenditure while we only spent $80 million for all of 2009. We are clearly adding capacity in test and assembly as well as some specific packaging requirements. We are now investing in our wafer fabs to expand capacity both in the Netherlands and also in our joint venture with TSMC in Singapore.

- Bolaji Ojo
EE Times


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