SoC brings down equipment cost, power consumption for VoIP
Keywords:IP-PBX? next- generation network? IP multimedia system? system on chip? VoIP?
The Comcerto 300xv system-on-chip (SoC) utilizes the multi-core Comcerto 300 architecture and decreases the bill of material costs for such price-sensitive platforms as passive optical networking (PON) multi-dwelling unit (MDU) equipment and IP-PBX systems.
The processor's flexible architecture makes it easy for developers to diversify their products, while enabling support for master/slave modes and multiple booting methods. This solution is a complete, production-quality OpenWrt-based Linux design kit which permits access to multiple applications and can be used to create a functionally complete routing platform.
The device is supported by a complete reference design package, including an open- source session initiation protocol (SIP) signaling stack and low-level board support packages (BSP). Platforms using this new processor retain full software feature and application programming interface (API) compatibility with prior Comcerto 300 designs. Furthermore, the software also supports wideband voice codecs for high-definition VoIP applications.
Product manager for Mindspeed's communications convergence processing business unit, Tricus Wang explains, "The Comcerto 300xv is an ideal solution for cost- and power-sensitive VoIP platforms ranging from passive optical networking equipment and IP digital subscriber line (DSL) access multiplexers to multi-service access nodes and IP-PBX equipment. It provides a complete, low-cost, high-value VoIP media and control processing solution between narrowband time-division multiplexing (TDM) and Ethernet, allowing inexpensive POTS termination systems to be built on an Ethernet / LAN-based architecture."
Pricing and availability: The Comcerto 300xv is now available for sampling and scheduled for volume production in the second half of 2010. Pricing (for device and software) starts at less than $18 in OEM volumes of 10,000 units for the lowest performance member of the family (M82321). It comes packaged in a 484-ball, 19mmx19mm low-profile ball grid array (LBGA). Both RoHS and non-RoHS versions are available.
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