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CVD system serves 20nm memory, logic chips

Posted: 27 Aug 2010 ?? ?Print Version ?Bookmark and Share

Keywords:chemical vapor deposition? CVD? dielectric film?

Applied Materials Inc. debuts the Applied Producer Eterna flowable chedcmical vapor desposition (FCVD) system. The company claims it is the only film deposition technology capable of electrically isolating the densely-packed transistors in 20nm-and-below memory and logic chip designs with a high-quality dielectric film. The gaps between transistors at this node can have aspect ratios of more than 30:1five times higher than current requirementsand highly-complex profiles. The Eterna FCVD system completely fills these gaps from the bottom up, delivering a dense, carbon-free dielectric film using less process steps and at up to half the cost of spin-on deposition methods.

"The need to fill smaller and deeper structures in advanced chip designs creates a physical roadblock for existing deposition technologies." Notes Bill McClintock, VP and general manager of the DSM/CMP2 business unit of Applied Materials.

The Eterna FCVD process delivers a liquid-like film that flows freely into virtually any structure shape to provide a bottom up, void-free fill. The system is installed at six customer sites for DRAM, flash and logic applications, where it is integrated on Applied's benchmark Producer platform.





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