Micron deploys Applied Materials' E3 process control system

Micron Technology Inc. is hoping to raise efficiency and product quality levels at its 300mm wafer fabrication facilities with the deployment of the Applied Materials E3 framework, an integrated engineering system that allows complex control strategies.

The E3 deployment on Monday allowed the semiconductor firm to replace a mix of in-house and third-party systems running on different platforms. It said that Applied Materials' E3 solution was chosen after a thorough assessment of several commercial systems because it provides a good balance of cost and control flexibility.

Micron's engineering teams are using the E3 system's fault detection and classification to minimize unexpected equipment downtime and prevent product deviations, run-to-run control to adjust processing settings in real time and equipment performance tracking to identify factory bottlenecks to quantify process variations. In addition, the statistical process control module is expected to improve efficiency and product quality at Micron's 300mm facilities.

"By integrating what were previously standalone functions into a common framework, the E3 system has transformed equipment automation and control technology, which has historically been complex and expensive to implement and maintain," Charlie Pappis, vice president and general manager of Applied Materials' Applied Global Services.