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Smart phone memory chips pioneer e-MMC 4.41 spec

Posted: 13 Sep 2010 ?? ?Print Version ?Bookmark and Share

Keywords:NAND flash? smart phones? memory? e-MMC 4.41?

Samsung Electronics Co. Ltd unveils 8GB and 16GB moviNAND embedded memory chips for use in smart phones. The new solutions are the first memory devices in the industry fully compatible with the latest e-MMC specification, the JEDEC's Embedded MultiMediaCard Product Standard v4.41.

Complying with the new higher performance e-MMC 4.41 specification, the chips are more efficient than solutions developed under the e-MMC 4.4 specification by providing features that improve the responsiveness of the e-MMC device to the host (or application processor).

 Samsung moviNAND embedded memory chips

The e-MMC 4.4 interface offered designers the flexibility of partitioning storage, such as using the single-level cell (SLC) area for high speed operations and the multi-level cell (MLC) area for high density data storage. Now, the e-MMC 4.41 interface standard provides an upgraded user experience, with a high priority interrupt (HPI) and improved background operation features.

The chips enable more efficient processing of orders. If the host wants to execute an application or read data while the e-MMC device is writing data, the host can send an HPI command to the device so that the device stops previous writing to respond to the newest command. With this feature, the host can receive the device's response without any latency.

Also, when the Samsung embedded memory is not in operation, the host can command it to use the free time for background operations such as garbage compaction, so that the embedded memory can reduce the write latency.

Samsung is also introducing the devices in ultra-thin five chip MCP (multi-chip package) solutions which measure just 1mm, a significant reduction over current four-chip MCPs that are 1.15mm in height (z-height). The moviNAND-based MCP will be available in combination with mobile DRAM. The advanced multipurpose MCP offerings will be available by the end of this year for use in mobile applications with high multimedia workload such as smart phones.

Samsung has already started producing 8GB moviNAND, using 30nm class 32Gb NAND flash chips in late July, and will start producing 16GB moviNAND using 20nm-class 32Gb NAND flash this month.

Samsung plans to start replacing its 30nm-class 32Gb NAND flash chips with a full line of 20nm-class 32Gb NAND chips for future moviNAND products later this year.





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