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Lattice goes green with CPLD packaging

Posted: 23 Sep 2010 ?? ?Print Version ?Bookmark and Share

Keywords:green manufacturing? lead? halogen? packaging?

Lattice Semiconductor Corp. has taken out halogen and lead from packages for its popular programmable logic solution for high-volume consumer electronics to better conform to environmental standards created by the Japan Electronic Industry Development Association and Europe's Waste Electrical and Electronic Equipment Directive. The company said it replaced bromine and chlorine in its ispMACH 4000ZE IC package material with metal oxides and red phosphorous

Saying that manufacturers of consumer electronics devices are concerned about their products' environmental impact, Gordon Hands, director of marketing for low density and mixed signal solutions, said the new ispMACH 4000ZE packages "allow them to meet higher standards for electronic waste while still meeting their power and cost targets."

The lead-free packages include the Plastic Leaded Chip Carrier, Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack, Fine Pitch BGA, Fine Pitch Thin BGA, Chip Scale BGA (csBGA), Ultra Chip Scale BGA, Chip Array BGA, Flip Chip BGA, and Quad Flat-pack Saw-singulated.

All TQFP package variations and the 64-Ball csBGA package of the ispMACH 4000ZE family are halogen-free and use pure tin (Sn 100 percent) for lead plating.

Lattice stressed that the lead-free packages are of the same high quality and reliability as those that contain lead.





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