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GigaMOS TrenchT2 MOSFETs come in low-profile DE-series packages

Posted: 07 Oct 2010 ?? ?Print Version ?Bookmark and Share

Keywords:GigaMOS TrenchT2? power? MOSFET?

IXYS Corp. introduced the new additions to its GigaMOS TrenchT2 Power MOSFET portfolio, the IXTZ550N055T2 and the IXFZ520N075T2. These devices combine the high-current ratings of IXYS' GigaMOS TrenchT2 product line with the advanced electrical, thermal and mechanical properties of IXYS' ultra-low profile DE-Series package technology.

IXYS Corporation has just announced the new additions to its GigaMOS TrenchT2 Power MOSFET portfolio with the release of the IXTZ550N055T2 and the IXFZ520N075T2 devices. These featured devices combine the high-current ratings of IXYS' GigaMOS TrenchT2 product line with the advanced electrical, thermal and mechanical properties of IXYS' ultra-low profile DE-Series package technology.

The new models have blocking voltages from 55V to 250V and current capabilities of up to 550Amps. The combined ultra-low profile packaging and high-current capabilities of these devices offer designers a compact high-current MOSFET solution for high-speed power switching designs such as DC-DC converters, inverters for solar power generation, electrical vehicles and electrical bikes, solid state relays, off-line UPS, synchronous rectification and primary-side switching.

These new GigaMOS devices are designed using IXYS' advanced-performance TrenchT2 process technology. This company says that the TrenchT2 process technology yields increased channel densities and exceptionally low values of RDS(on), as low 1mohm. These enhancements drive improved power handling capabilities and superior conduction and switching performance. Moreover, device consolidation is promoted through the reduction or all together elimination of multiple parallel lower current-rated MOSFET devices in high power switching applications. The final effect is a reduction in part count, as well as the number of required drive components, thus improving upon over-all system reliability and cost.

IXYS' proprietary DE475 package is a low inductance, high power, high- performance surface mount package. With an ultra-low package profile (3.175 x 40.6 x 19.56mm ), the DE475 features one-tenth the weight and one-fifth the volume of conventional isolated high power packages (i.e. SOT-227), providing designers with a unique compact device that delivers excellent power handling capabilities and thermal transfer characteristics.





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