Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Controls/MCUs

MIPS Technologies joins TSMC IP alliance

Posted: 14 Oct 2010 ?? ?Print Version ?Bookmark and Share

Keywords:chip fabrication? SoC? Soft IP Alliance Program?

MIPS Technologies Inc. has joined the TSMC Soft IP Alliance Program. Through the Soft IP Program, TSMC aims to yield specific design documents and technology information so that MIPS and other Alliance partners could optimize IP cores for TSMC's process technologies. The companies will likewise work together on roadmap alignment to expedite IP readiness.

MIPS VP of marketing and business development, Art Swift said, "We're pleased to expand our relationship with TSMC by joining its IP Alliance. By sharing design, technology and roadmap information with TSMC, we can drive toward closer alignment and speed development for our many customers who work with TSMC on chip fabrication. We look forward to continuing to deepen our relationship with TSMC to further benefit our mutual customers."

Meanwhile, deputy director of IP Portfolio Marketing at TSMC, Dan Kochpatcharin says,"The combination of TSMC's foundry-leading technologies and manufacturing capability with MIPS Technologies' soft IP cores will enable customers to gain early insight into the power, performance and area trade-offs inherent in their SoC designs. This is an increasingly critical factor in meeting time to market objectives."

TSMC's new Soft IP Program synergizes with TSMC's IP alliance portfolio, encouraging soft IP innovation and reuse through TSMC's Open Innovation Platform initiative. The platform initiative also aims to drive power, performance and area optimization which are important at advanced technology nodes.

Article Comments - MIPS Technologies joins TSMC IP alli...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top