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Intel SIP chip combines Atom, FPGA

Posted: 24 Nov 2010 ?? ?Print Version ?Bookmark and Share

Keywords:system-in-package? processor? FPGA?

Intel Corp. unveiled the first six members of its line of system-in-package (SIP) products announced in September. The products include an Atom and Altera FPGA die, and are geared to expand Intel's drive into embedded markets with the x86-based Atom.

The E600C series is designed to help embedded designers speed Atom-based chips to market. The FPGA blocks allow engineers to customize the devices for whatever interfaces or unique features their system requires.

The highCend chip uses a 1.3GHz Atom with a 400MHz graphics block consuming 3.6W and costing $106. The low-end device runs at 600MHz with a 320MHz graphics block, consumes 2.7W and costs $61.

The Altera FPGAs inside the 37.5mm2 package use more than 60,000 logic elements and can support six high-speed transceivers using more than 350 I/O pins. The transceivers can run at up to 3.125Gbps or support LVDS links with serdes at 840Mbps.

The FPGAs can be programmed with the Altera QuartusII Subscription Edition tools. They include PCIe logic, DSP multipliers and some internal memory. They leave an undisclosed amount of room for OEM custom logic.

Formerly codenamed Stellarton, the Intel Atom processors E665CT, E645CT, E665C, and E645C are scheduled to be available within 60 days. The E625CT and E625C are on track to be available in Q1 2011.

Board maker Kontron has E600C-based prototype boards available now, with full production beginning in Q2 2011.

The chips come with seven-year manufacturing support and support industrial and commercial temperature options. Some devices operate at 0C to 70C, others at -40C to 85C.

- Rick Merritt
EE Times

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