STATS ChipPac flip chip biz grows over 50%

Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.

In the past year, the company ramped up production of its Bond-on-Lead (BOL) interconnection technology which the company says enables the reduction in flip chip packaging cost while alleviating stress and mechanical damage to low K and extreme low K (ELK) layers in silicon. The company also cited its process innovations in areas such as bumped wafer thinning, advanced molding technology, and die and substrate handling were introduced to achieve thinner flip chip packages with higher yields.

"We have had phenomenal growth in our flip chip business this year. In addition to our sustained leadership in packaging for the mobile market, we have diversified our flip chip technology portfolio and gained market share in the computing and networking markets. We have also expanded our foundry alliances to enable early development and qualification of flip chip packaging solutions for advanced silicon nodes. We are confident that these factors will provide us with a healthy growth trajectory going into 2011," said Dr. Raj Pendse, STATS ChipPac vice president.