PCB thermal management tech gets US patent

Viasystems Corp.'s thermal management system for PCBs utilizes a copper heatsink as an integral part of the board rather than as an attachment. Labeled "锟組icroelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same.锟?, the technology holds US patent no. 7,741,566 B2.

Conventional methods for dissipating heat through a PCB used 锟絭ia farms,锟? or arrays of vias (copper-lined holes), which made heat to pass through the boards. As electronic miniaturization progressed and PCBs became crowded, via farms were no longer effective. Coin-attached copper heatsinks have been an important technical solution which the company supplies at high-volume from its plants based in China for several end-use markets.

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