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PCB thermal management tech gets US patent

Posted: 22 Dec 2010 ?? ?Print Version ?Bookmark and Share

Keywords:PCB thermal management? embedded heatsink?

Viasystems Corp.'s thermal management system for PCBs utilizes a copper heatsink as an integral part of the board rather than as an attachment. Labeled "�Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same.?, the technology holds US patent no. 7,741,566 B2.

Conventional methods for dissipating heat through a PCB used �via farms,? or arrays of vias (copper-lined holes), which made heat to pass through the boards. As electronic miniaturization progressed and PCBs became crowded, via farms were no longer effective. Coin-attached copper heatsinks have been an important technical solution which the company supplies at high-volume from its plants based in China for several end-use markets.

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