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Nujira to unveil second-gen handset test chip

Posted: 27 Jan 2011 ?? ?Print Version ?Bookmark and Share

Keywords:handset? test chip? cellular network?

Nujira is announcing its second-generation handset test chip at Mobile World Congress (MWC) in Barcelona next month and the completion of an Envelope Tracking Processor IC for cellular network infrastructure. Nujira has secured additional funding from its investors to help realize its handset vision, and interest from leading silicon vendors in the handset ecosystem has led to the expansion of its handset engineering team.

Nujira Coolteq.L Envelope Tracking power modulators can save over 1W in an LTE terminal, enabling a single multiband, multimode PA module to transmit 20MHz 4G signals using less power than today's single-band 3G PAs. In September, Nujira announced that it had licensed its Coolteq.L handset technology to a Tier 1 semiconductor vendor in the handset ecosystem. The company is now developing a commercial Envelope Tracking processor IC to replace the DC/DC converter in the handset, which will change the power consumption of 3.5G and 4G terminals.

"4G terminals will not work without Envelope Tracking," said Tim Haynes, CEO of Nujira. "Using standard power architectures, 4G terminals will use 75 percent more power than today's 3G terminals, and require up to seven PA modules to cover the whole of the allocated spectrum. With Envelope Tracking, terminals will use 30 to 50 percent less power and require just two PAs. The case for Envelope Tracking is overwhelming, which is why we are in detailed discussions with OEMs and partners representing more than 70 percent of the handset market."

Cellular terminal roadmap
At MWC in next month, Nujira is demonstrating its second-generation handset test chip to customers and partners. This device has already been delivered to a Tier 1 handset OEM and covers the full 20MHz LTE bandwidth. Based on this device, Nujira is developing a commercial Envelope Tracking processor IC for release later this year, which can be integrated into 3G, 3.5G and 4G terminals in place of the DC/DC converter. Both devices are compatible with the OpenET Terminal Interface published by the OpenET Alliance.

In Q2 2011, Nujira will release a flexible development platform to support Envelope Tracking implementation. This wideband platform, which covers all bands from 200MHz to 2,700MHz, will allow immediate evaluation of Coolteq.L modulator IC technology with no development effort. It enables PA vendors and OEMs to measure the benefits of Envelope Tracking across multiple frequency bands, and acts as a reference environment for PA characterisation, PA development and integration of the Envelope Tracking modulators.





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