TSMC, Taiwan university create multi-angle 3D chip

Taiwan Semiconductor Manufacturing Co. Ltd and the National Taiwan University have jointly designed a 3D TV chip that would allow TV watchers to view an object in stereo from various angles. The new chip will be produced in 40nm process technology.

3D TV typically allows viewing of an object from one position for which two views have been captured.

The National Taiwan University's DSP IC Design Laboratory has developed the 3D chip as well as STBs based on the chip to enable TV viewers to see different angles of an object's image. In addition, the 3D chip comes with traditional HDTV and 3D TV functions.

A paper on the chip is due to be presented at the International Solid State Circuits Conference (ISSCC) to be held in San Francisco, TSMC said.

- Peter Clarke
??EE Times