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Osram converts chip plants to raise LED output

Posted: 10 Mar 2011 ?? ?Print Version ?Bookmark and Share

Keywords:expansion? Malaysia? 6-inch wafers? InGaN chips? white LEDs?

In a bid to expand its total LED output, Osram Opto Semiconductors will convert its two chip production facilities to 6-inch wafers and increase both plants' capacity.

A new production building is currently under construction in Penang, Malaysia, while in Regensburg, Germany, the existing space is being reallocated.

The two facilities will each be converting to the new manufacturing technology, introducing 6-inch wafers to replace the current 4-inch wafers. These measures are expected to almost double the chip production capacity for white LEDs by the end of 2012.

The capacity expansion will primarily affect InGaN (indium gallium nitride) chips employing thin-film and UX:3 technology, which are required in the production of white LEDs.

Osram facility

Chip plant under construction: Osram is adding a chip plant on the grounds of its facility in Penang. (Photo courtesy Osram; sourced, re-touched by EE Times-Asia.)

The Penang chip manufacturing plant, which opened nearly two years ago, has been slated for further expansion with the new production building and conversion to 6-inch wafers. The total manufacturing area will be raised to around 269,000square feet in 2012, creating some 400 additional jobs in the process.

At the Regensburg plant, the available area is to be reallocated and InGaN production to be converted step-by-step from as early as June 2011.

"By expanding our capacities for high-performance InGaN chips, we are consistently consolidating our market position. The LED market harbors great growth potential in many different fields of application and we intend to continue harnessing this," said Aldo Kamper, CEO of the company, in a statement.

- Mark LaPedus
??EE Times





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