U.S. Circuits obtains Maskless Lithography DI system

Digital imaging supplier Maskless Lithography Inc. announces the delivery of direct-write imaging (DI) system to U.S. Circuits Inc.'s facility in Southern California.

As the PCB industry approaches 50micron feature sizes, the limitations of contact printing are becoming apparent. Thus, Maskless' DI systems are gaining attention. DI achieves more than twice the throughout of conventional digital technologies like laser direct imaging (LDI) and dot matrix, and don't require resists and other support features. The technology is particularly suitable for performing ultra-quick turn prototyping, or volume production of high layer counts and high density interconnects (HDI) solutions.

Over the past 18 months, MLI has achieved several milestones, more than tripling the size of the company, particularly in the area of design and customer technical support. The company's third generation products will be officially unveiled in April 2011.