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STMicroelectronics package enables 40% thinner power chips

Posted: 16 Mar 2011 ?? ?Print Version ?Bookmark and Share

Keywords:AC? switch? power? package? rectifier?

STMicroelectronics (ST) debuts the SMBflat three-lead surface-mount package that enables the miniaturization of control modules requiring compliance with IEC 60370 and IEC 60335.

ST is using SMBflat to house an AC switch, a silicon-controlled rectifier (SCR) and three types of Triac. These are used in valve, motor or pump controls, lamp igniters and circuit breakers.

Occupying only half of the PCB area of the SOT-223, the new package allows ST's new ACS108 1-Amp AC switch to achieve what the company claims is the highest current density for the device type.


The SMBflat package is also 40 percent skinnier than the SOT-223, which increases freedom for designers to miniaturize enclosures.

Also, the 'creepage' distances of ST's X02 series SCRs and Z01 series Triacs, which use this new package, will help meet the insulation requirements of the major safety standards for domestic and industrial electrical equipment.

A specific footprint can be designed on the PCB, where either SOT-223 or SMBflat packages can be soldered. This solution guarantees full compatibility of both packages and provides flexibility at the production stage.

The SMBflat package measures 3.95 x 4.6 x 1.1mm. It is a PCB footprint solution that is compatible with SOT-223 but enables 3.4mm creepage distance. It is RoHS compliant and halogen free.

The SMBflat package is a feature of the ACS108-6SUF-TR AC switch, X0202NUF silicon controlled rectifier (SCR), and the Z0103/07/09MUF series of Triacs. All devices are available immediately in sample quantities. Outline pricing is $0.21 for Z01xxMUF Triacs, $0.31 for the X0202NUF and $0.50 for the ACS108-6SUF-TR, all in minimum quantities of 5000. Alternative pricing options are available for larger orders.

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