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Logic chips boast small size

Posted: 04 Apr 2011 ?? ?Print Version ?Bookmark and Share

Keywords:logic? leadless package? handheld?

Targeting portable handheld devices, NXP logic has released what they say are the world's smallest logic packages measuring 0.9x1.0x0.35mm with 0.35mm pitch. The compact packaging design of the chips is aimed at portable handheld devices such as smartphones, tablets and SD cards where chip and board space comes at a premium.

The SOT1115 package decreases package size by 10 percent for the 6-pin version compared to the previous smallest package, SOT891. The 8-pin SOT1116 decreases the package size by 60 percent, compared to the previous smallest 8-pin package SOT833, enabling manufacturers to radically minimize their PCB size.


The SOT1115 package measures 0.9x1.0x0.35mm.

NXP has conducted studies of the mechanical failure modes of very small logic packages and determined that leadless plastic packages perform better in terms of mechanical adherence to the PCB. When compared against packages of the same footprint, NXP's leadless packages outperform leaded and leadless WCSP packages of similar size by requiring up to four times more force to dislodge. This is because NXP's leadless packages have a greater contact area with the PCB, giving them better mechanical performance and robustness.

Key features of the SOT1115 and SOT1116 include the smallest footprint, greatest electrical contact area, and shear force resistance from the PCB. All of NXP's single-, dual- and triple-gate functions are available in these smaller packages.

The NXP SOT1115 and SOT1116 packages are available for distribution at US $0.16 and $0.21 respectively.

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