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New flip-chip techs, apps loom ahead

Posted: 15 Apr 2011 ?? ?Print Version ?Bookmark and Share

Keywords:flip-chip packages? flip-chip? market growth? wire bonding?

Yole Dveloppement's new report reveals that flip-chip packages were worth about $16 billion by the end of 2010, making up 13 percent of all IC packages and more than 29 percent of the global IC assembly, packaging and test market.

Yole analysts believe that the flip-chip market is still in a growth phase, despite the fact that it looks like a mature market at first glance. Major flip-chip technology and application, and supply chain transformations loom ahead, according to the analysts.

"Renewed interest in flip-chip technologies is motivated in many application areas concurrently by such factors as the rising cost of gold used for wire bonding, the need for low-thickness devices, continued CMOS downscaling, higher currents and temperatures and lower voltages," said Christophe Zinck, project manager at Yole, in a statement.

Flip-chip market

Today, many sophisticated devices can no longer be packaged with wire bonding technology and mobile applications increasingly require footprint and weight reduction coupled with higher electrical performance, according to Yole. The emergence of 28nm CMOS technology poses new quality and reliability constraints on interconnect technologies so as to cope with the increasing fragility of the back end of line, which may disqualify wire bonding, Yole said.

Ever-increasing IO density is also making it necessary to develop new bumping and substrate technologies, Yole added, warning that these constraints could prove to be obstacles to the continuation of Moore's Law if not resolved.

- Dylan McGrath
??EE Times





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