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Applied announces packaging, display forays

Posted: 18 Apr 2011 ?? ?Print Version ?Bookmark and Share

Keywords:advanced packaging? wafer-level packaging? AKT-Aristo Twin system? touch-enabled displays?

In a bid to penetrate the IC packaging and display domains, Applied Materials Inc. recently announced plans to establish a packaging center and design a system for producing touch-enabled displays.

The company has entered into a research partnership agreement with the Institute of Microelectronics (IME) to build a center in advanced packaging in Singapore. IME is a research institute managed by the Agency for Science, Technology and Research (A*STAR).

The center will be located at Singapore's Science Park II and will focus on developing new capabilities in advanced packaging. It will have a full line of wafer-level packaging (WLP) processing equipment and will conduct research in semiconductor hardware, process and device structures.

IME is a research institute with advanced R&D capabilities in 3D ICs using TSV technology. Last year, Applied Materials opened its Singapore Operations Center for manufacturing advanced semiconductor equipment at Changi North Industrial Park.

Separately, Applied has rolled out the AKT-Aristo Twin system for manufacturing touch-enabled displays. Featuring two independent processing tracks on a single system, the AKT-Aristo Twin enables the simultaneous fabrication of two different film stacks.

There are several touch-screen technologies on the market, with capacitive multitouch displays being the preferred technology for mobile applications. Advanced multitouch displays require the deposition of up to 15 or more PVD film layers during manufacturing.

The new AKT-Aristo Twin system is suited to the demands of fabricating both glass and rigid plastic-based advanced touch panels, providing up to 50 percent higher throughput than competing systems and using half the manufacturing space.

Based on the AKT New Aristo PVD platform, the AKT-Aristo Twin system is capable of handling a wide range of substrate sizes up to 5.5m2. The system also features leading-edge rotary target technology to achieve high production yield and the lowest available cost-per-substrate.

- Mark LaPedus
??EE Times





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