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SMSC licenses ICC technology to AMD, Qualcomm

Posted: 03 May 2011 ?? ?Print Version ?Bookmark and Share

Keywords:Inter-Chip Connectivity? USB 2.0 standard? analog interface?

SMSC has agreed to license its Inter-Chip Connectivity (ICC) technology to Advanced Micro Devices Inc. (AMD). ICC is a low-power version of the 480Mbps USB 2.0 standard created for chip-to-chip links.

Under its ICC license with SMSC, AMD can develop devices that are designed to be compliant with the HSIC specification for USB 2.0 host applications.

ICC enables the USB 2.0 protocol to be delivered over short distances, consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining 100 percent software compatibility with an analog USB 2.0 connection.

Qualcomm Inc. and another ARM-based mobile SoC vendor have taken licenses to SMSC's ICC technology. The news comes at a time when the MIPI Alliance, an ad hoc group developing mobile chip interfaces, is months away from releasing a new spec that will upgrade an existing 200Mbps link to hit data rates from 1 to 2.9GHz. Mobile chipmakers have broadly adopted the group's camera and display interfaces, but not the 200Mbps interconnect about to get the upgrade.

- Mark LaPedus
??EE Times

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