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TSMC sees no wafer supply disruptions after March quake

Posted: 17 May 2011 ?? ?Print Version ?Bookmark and Share

Keywords:wafer supply? Japan earthquake? chip-making equipment?

Taiwan Semiconductor Manufacturing Co. Ltd believes the aftermath of the March 11 Japan earthquake and tsunami will not pose any short- to medium-term supply-side challenges, said TSMC Europe president Maria Marced.

Speaking on the sidelines of the GSA & IET International Semiconductor Forum in Munich, Marced said that TSMC had secured all the prime wafer supply that it requires. This is despite the closure of a Shin-Etsu plant in northern Japan that reportedly is responsible for about 20 percent of the 300mm diameter raw wafers. That plant is expected to return to pre-quake capacity by the end of June to early July.

"There is no supply-side impact, except perhaps on chipmaking equipment, but the lead times on that are so long that it should not affect us some time and we should be able to juggle things around," said Marced.

However, Marced did indicate whether or not there could be some demand-side impact. "Not our customers, but our customers' customers may be facing problems. If they reduce output because of a missing component or material, it can affect demand at our customers," she said. Nonetheless TSMC has not reduced its second quarter or full guidance.

For the full year the company expects to achieve 20 percent revenue growth in an overall semiconductor market that will only grow by 2 percent.

- Peter Clarke
??EE Times

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