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Partnership aims hi-tech MEMS production process

Posted: 07 Jun 2011 ?? ?Print Version ?Bookmark and Share

Keywords:MEMS? manufacturing process? wafer-level bonding?

The EV Group (EVG) has collaborated with the Industrial Technology Research Institute (ITRI) in the developing advanced manufacturing processes for next-generation MEMS devices.

As part of the collaboration, ITRI has purchased an EVG510 semi-automated wafer bonding system and an EVG6200 automated mask alignment system with top-bottom alignment and bond alignment options. EVG will also work closely with ITRI to develop, optimize and customize ITRI's wafer-level bonding processes for its partners and customers.

The new EVG systems were already installed at ITRI's Micro Systems Technology Center (MSTC) for wafer-level anodic, eutectic and metal thermo compression bonding in the production of MEMS devices. According to the companies, EVG510 bonder will play a key role in supporting the ITRI's transition to 200mm MEMS wafer processing.

"At ITRI's Micro Systems Technology Center, our mission is to create innovative applications and develop interdisciplinary technologies that will drive continued growth in the MEMS industry," stated Tzong-Che Ho, center director of ITRI's MSTC. "We are pleased to be working with EV Groupa recognized leader in MEMS manufacturing equipment and process expertiseto develop new processes that will enhance the competitive edge of our partners and customers."

According to IHS Suppli, a market research company, the MEMS market will grow rapidly from 2012 through 2014. Key factors for market development include the use of MEMS devices, accelerometers, gyroscopes, pressure sensors and other MEMS devices for automotive and consumer mobile communications applications.

"ITRI has played a pivotal role in maintaining Taiwan's position as a center of innovation and excellence in the field of microelectronics," said Dr. Viorel Dragoi, chief scientist of EV Group. "We look forward to continuing our long-standing relationship with ITRI, and leveraging our industry-leading technology and process expertise to support their MEMS process development and pilot production services."

Wafer-level aligned bonding enables MEMS technology to protect the miniature and fragile mechanical devices as the wafer goes through the remainder of the manufacturing process. Wafer-level bonding also creates a zero-level package to seal and encapsulate the device. Wafer bonding systems are designed for high-volume manufacturing with modular configurations for easy transfer of R&D processes to production.

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