Alliance pushes for next-gen memory tech

Open-Silicon Inc. and Micron Technology Inc. have entered into an agreement that will enable them to explore opportunities around Micron's Hybrid Memory Cube (HMC) products. The two companies will initially focus on data networking and high-performance computing markets. Open-Silicon's knowledge in these verticals and its broad ecosystem for ASIC, ASSP, and derivative IC development, combined with Micron's cutting-edge HMC technology, offer an opportunity to create next-generation memory solutions optimized for various markets.

Micron's HMC technology is said to be a new architecture unique to the market today. It combines fast logic process technology with advanced DRAM. As multicore processing continues to advance semiconductor design to new levels, this technology provides memory and performance suited to these next-generation systems.

"Open-Silicon offers the right mix of networking and computing architectural knowledge, semiconductor development expertise, and software and emulation services to support an expanding ecosystem developing around this new memory technology," said Robert Feurle, vice president of DRAM marketing of Micron.

"Micron has developed groundbreaking memory technology that will enable a new level of system performance and integration, as well as new classes of applications that we are only beginning to understand today. We are proud to work with Micron on supporting Hybrid Memory Cube technology, and are excited to know that these solutions will be valuable to the data networking and computing markets that Open-Silicon presently serves," said Naveed Sherwani, president and CEO of Open-Silicon.