FCI, Fujikura team up for IC packaging tech

Fujikura Ltd. announced its partnership with FlipChip International LLC (FCI) on next-generation semiconductor packaging technology. FCI and Fujikura have agreed to collaborate on the development and commercialization of next-generation semiconductor packaging including flexible substrate based embedded die, Fan-Out packages, and high density 3D interposer technologies.

FlipChip International is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. It is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets.

Fujikura Ltd, on the other hand, is a supplier of optical transmissions systems, network systems, electronic materials, power systems, coated wires, magnet wires, electronic materials for equipment and metallic materials. For 120 years, Fujikura has been providing connection (Tsunagu) technologies.

Bob Forcier, CEO of FCI, said "Fujikura is a global leader in the interconnect technologies ranging from optical connection to high speed copper interconnects.

Forcier added, "Fujikura Ltd has a powerful technology roadmap which complements perfectly with FCI's product roadmap. We feel privileged to have them as a partner."

Takamasa Kato, executive vice president and member of the board of Fujikura, believes the same way saying that FCI is the most reliable partner for them in the said endeavor.

"FCI is the world leading WLCSP and bumping supplier and have a great deal of experience and aggressive programs of future business in the semiconductor packaging field. We consider that FCI is the most reliable partner for us to cooperate in this exciting field," Kato said.