USB 3.0 hub controllers support 2-layer PCB designs

SMSC has revealed a family of USB 3.0 hub controllers that according to the company offers the industry's smallest footprint and hybrid speed configuration with an optimized BOM cost for designers of the emerging USB 3.0 ecosystem. The SuperSpeed USB hubs also feature programmable flexibility for configuration of performance enhancing features and the ability to support two-layer PCB designs. The USB553X family is an excellent solution for USB port expansion in docking stations, port replicators, all-in-one monitors, as well as peripheral hubs for ultra-mobile PCs, tablets and notebooks that are outfitted with SuperSpeed USB host connectivity.

"USB is a well designed interface for bridging virtually any I/O port found in a PC today. With the added bandwidth inherent in the SuperSpeed version, USB 3.0 is capable of aggregating audio, video, storage and human interface data over a single USB connection on a PC", said Mark Fu, senior director of marketing at SMSC. "Our seven-port hub, the USB5537, is well suited for a USB docking station requiring all of these capabilities."

The USB5534 has four USB 3.0 downstream ports and comes in an 8 x 8mm² 64 QFN package while the USB5537 provides four USB 3.0 ports and three USB 2.0 ports from one USB connection to a USB host system in a 10 x 10mm² 72 QFN package. The USB5537 is extremely versatile when used in a USB docking station where its seven USB ports can be used as internal and external attach points. A USB hub is typically located in the center of a USB docking station to act as a central port of connectivity and the hub is designed specifically with this function in mind. Armed with unique features such as PortMap, PortSwap, VariSense, PHYBoost and USB Battery Charging 1.2, the USB5537 handles embedded USB connections with ease and provides designers the flexibility to meet the industry's stringent USB certification requirements that often create configuration challenges to even experienced system designers, noted SMSC.

Both the USB5537 and USB5534 retain SMSC's MultiTRAK technology for high-speed USB traffic that provides a dedicated pipeline, or a transaction translator, for every downstream full-speed device.

"Bridging the performance and interoperability gap with legacy USB 1.1 and USB 2.0 products is a critical customer requirement when selecting a USB 3.0 hub solution," noted Fu. "The USB553x family has inherited the market proven maturity from five generations of high-speed USB hub products that have won the trust of leading OEMs and ODMs worldwide. Our USB 2.0 experience and knowledge of interoperability pitfalls makes SMSC a natural partner for designing USB 3.0 hub solutions." In addition to meeting commercial design requirements, the USB553x family is also available in an industrial temperature grade that meets -40°C to 85°C operating conditions.

Samples of USB5537 and USB5534 are available today and range from $3.30 (commercial grade) to $4.45 (industrial grade) per unit. Pricing is based on 1K quantities.