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Placement system touts high-speed die bonding

Posted: 29 Aug 2011 ?? ?Print Version ?Bookmark and Share

Keywords:die bonding? flip chip bonding? IC manufacturing?

Assemblon Netherlands B.V. will bring its parallel placement technology to the semiconductor backend industry with its A-Series Hybrid. The single machine solution targets applications such as system-in-package (SiP), multichip module (MCM) manufacturing and flip chip bonding.

The A-Series Hybrid uses Assemblon's Programmable Placement Force Control to avoid cracking during placement processes. The device also features fluxer dip station and high accuracy cameras.

The machine can bond flip chips at a repeatability of 10?m at 2,500 components per hour (cph) per single placement head. Die bonding speeds are 3,500cph per head at 25?m while passives are placed at 8,000cph at 40?m, including fluxing. The first A-Series Hybrid model on the market can carry up to three specialized Twin Placement Robots (TPR), holding two heads per robot for a total flip chip bonding speed of 15,000 placements per hour per machine. It can also carry conventional placement robots for chip shooting for passives as small as 01005 (0402M metric coding). In fact, the machine can be configured with any combination of robots for passives or dies toward the needs per specific application.

"Where different equipment is currently used in the industry to place chips and known good dies for manufacturing of SiP, MCM and high performance flip chip modules, this can now be done on one single machine. It makes the A-Series Hybrid a true single machine solution, reducing production and investment costs for module manufacturers," stated Patrick Huberts, program manager, Assemblon.

The A-Series Hybrid is programmed with various closed loop processes to control the picking and placing of components such as dies. During the controlled linear robot movement, it continuously monitors the position of the parts before placing them with the Programmable Placement Force Control feature that can be as low as 0.5N. The company promises 100 percent damage-free components, assured by the total elimination of impact forces and controlled by the board collision detection mechanism. According to Assemblon, first-pass-yield is at 99.99 percent, eliminating waste, rework and defective products.





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