Three-axis gyroscope boasts 10.5mm³ footprint

STMicroelectronics has launched a small high performance three-axis analog gyroscope, to expand its motion-sensor portfolio. The L3G3250A combines the same micromachining technology that ST has already used to produce in its package-shrinking roadmap. The company claims that the device is the first three-axis gyroscope to meet the demand for smaller footprints in next-generation applications such as gaming and virtual reality input devices, motion control for MMI (man-machine interfaces), GPS navigation systems, and appliances and robotics. The sensor is housed in a 3.5 x 3 x 1mm package, reducing the footprint from 17.6mm³—the current generation in production today—to just 10.5mm³, a reduction of nearly 40 percent.

With a resonant frequency beyond the audio bandwidth, the L3G3250A is immune to audio noise, such as from speakers mounted close to the sensor, and mechanical vibrations coupled through the printed circuit board, therefore operating with greater accuracy and reliability. In addition, its design, with a single sensing structure for motion measurement along all three orthogonal axes, further increases sensing accuracy and reliability and delivers high level of output stability over time and temperature. The combination of high sensing resolution with immunity to audio noise and vibrations makes motion-sensing user interfaces more realistic in mobile phones, tablets, game consoles, and other smart consumer devices.

The L3G3250A offers two user-selectable full scales—625 or 2,500dps—with sensitivities of 2mV/dps and 0.5mV/dps, respectively. The high range allows the device to detect and measure very fast gestures and movements. Other features include an embedded self-test function, a wide supply voltage range (2.4–3.6V), embedded power-down and sleep modes to optimize power management in battery-operated devices, an embedded low pass filter and a high pass filter reset function, and high shock survivability.

The device operates over an extended temperature range (-40°C–85°C) and is available in a 3.5 x 3 x 1mm³ LGA-16 ECOPACK RoHS and "Green" compliant package.

Engineering samples are available now and volume production is scheduled for Q4 2011, with unit pricing at $3.95 for volumes in the range of 1,000 pieces.