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LIN transceivers tout smaller DFN packages

Posted: 12 Sep 2011 ?? ?Print Version ?Bookmark and Share

Keywords:microcontroller? touch? LIN? transceiver? DFN?

Atmel Corp., a microcontroller and touch solutions company, has announced the release of two local interconnect network (LIN) transceiver ICs in smaller DFN packages. These standalone transceivers come in smaller packages (about 75 percent of the PCB area) and are claimed as the first to have wettable flanks that make solder joints visible.

Compared to standard SO8 packages at 56.5mm, the DFN14 package for the ATA6670 measures 34.5mm, while the DFN8 package for the ATA6663 is about 33mm. Space and cost savings are critical for LIN bus networking applications such as automotive body electronic systems, including door modules, seat control, intelligent sensors or powertrain applications. Since both DFN packages are pin-compatible, either single- or dual-LIN transceiver can be used on the same PCB design.

LIN DFN packages with wettable flanks enable the use of automated optical inspection (AOI) tools during final quality tests, which eliminate X-ray inspections to avoid cost-intensive tool investments. In addition, the wettable flanks enable improved soldering performance for temperature cycling.

The new LIN devices are manufactured using Atmel's high-voltage BCD-on-SOI process, also known as SMART-I.S. technology, which is optimized for operations up to 40V for applications in harsh automotive environments. The results of manufacturing on the SMART-I.S. technology is EMC robustness (EMC test and conformance test LIN2.1, Europe, and SAE J2602-2, US), and ESD protection (exceeding 6kV).

Samples of the ATA6670 and the ATA6663 are now available with prices starting at $0.45 (ATA6663) and $0.90 (ATA6670) for 10,000 pieces orders. To simplify and speedup design-ins, evaluation kits for both devices are on offer at $50.

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