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Amkor buys Toshiba's assembly, test fab

Posted: 04 Oct 2011 ?? ?Print Version ?Bookmark and Share

Keywords:acquisition? assembly and test? wafer fabrication?

In a deal that is expected to close by January 2012, Amkor Technology Inc. has bought Toshiba Corp.'s assembly and test operations in Malaysia for an undisclosed amount. In addition to the acquisition of Toshiba Electronics Malaysia Sdn. Bhd. (TEM), Amkor will gain certain intellectual property rights subject to certain agreements and government approval.

TEM has steadily expanded the scale of its assembly operations, primarily of discrete and analog semiconductors. In recent years, its main product has been power ICs.

Toshiba said it will continue to subcontract power semiconductor assembly and test to TEM. The company will shift its focus and resources to front-end wafer fabrication for power ICs by reinforcing production capabilities at Kaga Toshiba Electronics Corp., the manufacturer's discrete semiconductor production base in Japan's Ishikawa prefecture.

Toshiba said it positions power ICs as a driver of growth for its semiconductor business and seeks to maximize cost competitiveness across its front- and back-end operations. Transferring ownership of TEM to Amkor will allow the first to take advantage of the latter's large-scale production and material procurement capabilities and boost the overall efficiency of its power semiconductor operations.

Amkor expects the transaction to strengthen its relationship with Toshiba, and grow its semiconductor assembly and testing business. In particular, Amkor believes that TEM will provide an excellent platform for increasing its presence in the power discrete market, where the first estimates an unmet customer demand for outsourced assembly and test services.

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