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eWLB tech aimed for mobile, cloud apps

Posted: 10 Oct 2011 ?? ?Print Version ?Bookmark and Share

Keywords:eWLB? cloud computing? packaging?

STATS ChipPAC Ltd has unveiled its fan-out wafer level packaging (FO-WLP) technology platform geared for smartphones, media tablets and cloud computing applications. One of the key features in the FO-WLP is embedded Wafer Level Ball Grid Array (eWLB), noted the company.

"Electronic product differentiation drives the need to integrate more functionality, achieve faster performance and increase computing power; all in a smaller end product. With the convergence of computing functionality and high speed communication, semiconductor companies need to provide new product features and ramp to volume production more quickly to satisfy the compressed development and product life cycles," stated Hal Lasky, executive VP, STATS ChipPAC.

The company said it is leading the development of next-generation eWLB by introducing advanced architectures such as small die, large die, multidie, multilayer and stacked Package-on-Package (PoP). STATS ChipPAC is incorporating through silicon via (TSV) and integrated passive devices (IPD) technologies with eWLB in advanced 2.5D and 3D designs. According to them, this eases heterogeneous technology integration where mixed die sizes and silicon lithography nodes are combined into thin package profiles to meet enhanced flexibility, functionality and form factor objectives.

"Going forward, the convergence of telecommunications, information technology, consumer electronics and media solutions are driving the refinement, boundaries and integration of high performance, high bandwidth functionality in very thin semiconductor packages. eWLB technology scales packaging solutions to provide our customers with increased integration of multiple functions such as baseband processors, RF transceivers, power management components and application processors for improved system performance in thinner and smaller package dimensions," explained Han Byung Joon, CTO, STATS ChipPAC.

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