SMT package designed for transistors, diodes

Microsemi Corp. has uncloaked what it claims as the industry's smallest surface mount package. The compact U4 is 70 percent smaller than its predecessor, the U3, and is engineered for power transistors and diodes, added the company.

The product has achieved Defense Logistics Agency (DLA) qualification for various products. The devices assembled as vehicles for this package qualification include medium power NPN and PNP bipolar transistors. Microsemi will also pursue qualifications for additional device types to support customer-specific requirements, stated the company.

The package is constructed with aluminum nitride ceramic that provides excellent heat dissipation, according to Microsemi. This is particularly important for small products such as power supplies, converters and regulators that operate at high current rates and cause overheating issues.

"Microsemi created the hermetic U4 package to provide defense contractors with a rugged surface mount packaging solution for space-constrained products used in military environments," stated Simon Wainwright, VP of marketing and business development for Microsemi.

The U4 has a typical power rating of 5-15W at Tc=25°C. Packaged parts are compatible with current pick-and-place assembly processes and are offered in tape-and-reel format.