Embedded die tech-based 3D package unveiled

FlipChip International LLC and Fujikura Ltd have rolled two embedded die packages for single die or multidie semiconductor packaging applications. The ChipletT and ChipsetT are based on Fujikura's flex-based laminate embedded die technology, WABE Technology.

According to the companies, the products provide cost-effective, ultra low profile packaging by leveraging roll to roll flex fabrication processes and technological extensions. These include 3D, System in Package, RDL, Fan-In, Fan-Out, TSV and NanoPillar options. Use of WABE Technology will enable ChipletT and ChipsetT body thicknesses in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, stated the companies.

ChipletT and ChipsetT will target the $22 billion semiconductor packaging market with end markets that include smartphones, tablets, medical diagnostics, advanced server farms, automotive, security, sensors and photovoltaics where ultra-thin and very low cost chip packaging enables innovative products and designs. ChipletT and ChipsetT provide a common package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density. The embedded flex based technology also delivers improved product reliability with improved system performance thereby conserving vital battery life.

"We are excited to announce ChipletT and ChipsetT to our customers and to the whole semiconductor industry. We believe that the ChipsetT family of packages set a new standard in miniaturization and will be a game changer for portable devices that relentlessly seek thinner profiles, longer battery life and higher functionality," stated Bob Forcier, FlipChip CEO.

"We believe that our WABE Technology, embedded die technology based on the extensive experience in flexible printed circuit technology, will deliver innovative and cost-effective solutions in this exciting area," noted Takamasa Kato, EVP of Fujikura.