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TI, Samsung, Hynix fill Kindle Fire's interior

Posted: 21 Nov 2011 ?? ?Print Version ?Bookmark and Share

Keywords:tablet component? processor? flash memory?

A repair company has revealed that Inc.'s Kindle Fire uses components from LG, Hynix Semiconductor, Texas Instruments and Samsung. Miroslav Djuric, director of technical communication at iFixit said the firm opened and looked inside the tablet a day after the devices were shipped.

Amazon expects the tablet to sell as many as five million in Q4 and more next year. While that is not as many units as Apple's iPad, it is enough that investors have been watching to see which components are in the new device.

Kindle Fire

Kindle Fire is poised to sell as many as five million units in Q4.

"Three to five million units per quarter could be meaningful for certain component makers," stated Brad Gastwirth, of independent research firm ABR Investment Strategy. "For the fourth quarter, three to five million is pretty much baked in but if this grows to significantly more per quarter, it will become very significant to many component companies."

Djuric indicated that the main application processor of the Fire is a TI OMAP 4430 processor, the 8GB flash memory chip is from Samsung, a DDR 2 RAM component is from Hynix and the display was made by LG.

The Kindle Fire looks similar to the BlackBerry PlayBook, leading some analysts to speculate the devices have the same components. "It's similar to the PlayBook in the sense that it has the same basic componentsmotherboard, battery, display," Djuric added. "The case opens up similarly to the PlayBook as well. But inside, it has a completely different layout, smaller battery and different orientations for its components."

- Alistair Barr

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